cht3091aqag rohs compliant ref. : dscht3091aqag0211 - 30 jul 2010 1/6 specific ations subject to change without notice united monolithic semiconductors s.a.s. route dpartementale 128 - b.p.46 - 91401 orsay cede x france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 dc-12ghz attenuator gaas monolithic microwave ic in smd leadless packag e description the cht3091aqag is a variable dc- 12ghz attenuator designed for a wide range of applications, from military to commercial communication systems. it is supplied in lead-free smd package. main features broadband performances: dc-12ghz 15dbm typical input 1db compression point (any attenuation) dc bias: -5v cht3091aqag dc- 12ghz attenuator ref. : dscht3091aqag0211 - 30 jul 2010 2/6 specific ations subject to change without notice route dpartementale 128, b.p.46 - 91401 orsay ced ex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 main characteristics tamb. = 25c symbol parameter min typ max unit fin input frequency range dc 12 ghz min att. minimum attenuation |s21| (vs=0v;vp=-5v) 3.0 4.0 db max att. maximum attenuation |s21| (vs=-5v;vp=0v) 2 0 23 db vswrin input vswr (any attenuation) 2.:1 vswrout output vswr (any attenuation) 2.:1 pin1db input 1db compression point.(any attenuation) 14 15 dbm these values are representative of onboard measurem ents as defined in the application section. esd protection: electrostatic discharge sensitive d evice. observe handling precautions! absolute maximum ratings tamb. = 25c (1) symbol parameter values unit vp vp control voltage -6v to +0.6v v vs vs control voltage -6v to +0.6v v pin rf input power 20 dbm ta operating temperature range -40 to +85 c tstg storage temperature range -55 to +155 c (1) operation of this device above anyone of these parameters may cause permanent damage. typical bias conditions for an ambient temperature of +25c symbol pin no. parameter values unit vs 6 vs control voltage -5 to 0 v vp 7 vp control voltage 0 to C5 v all other pins are not used for this device (but rf in: pin 2 and rfout: pin 11).
dc-12ghz attenuator cht3091aqag ref. dscht3091aqag0211 - 30 jul 2010 3/ 6 specifications subject to change without notice route dpartementale 128, b.p.46 - 91401 orsay ced ex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 demonstration board (pcb) rfin cht3091 rfout typical results tamb = +25c vp = 0v to -5v & vs = -5v to 0v pcb measured performance (t amb. 25c) -25 -24 -23 -22 -21 -20 -19 -18 -17 -16 -15 -14 -13 -12 -11 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 frequency (ghz) dbs21 & dbs11 (db) s11dbmin_board s21dbmin_board s11dbmax_board s21dbmax_board s21dbmin_pkg s21dbmax_pkg
cht3091aqag dc- 12ghz attenuator ref. : dscht3091aqag0211 - 30 jul 2010 4/6 specific ations subject to change without notice route dpartementale 128, b.p.46 - 91401 orsay ced ex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 application note the design of the motherboard has a strong impact o n the over all performance since the transition from the motherboard to the package is c omparably large. in case of the smd type packages of united monolithic semiconductors the mo therboard should be designed according to the information given in the following to achieve good performance. other configurations are also possible but can lead to di fferent results. if you need advise please contact united monolithic semiconductors for furthe r information. smd type packages of ums should allow design and fa brication of micro- and mm-wave modules at low cost. therefore, a suitable motherbo ard environment has been chosen. all tests and verifications have been performed on roge rs ro4003. this material exhibits a permittivity of 3.38 and has been used with a thick ness of 200m [8 mils] and a 1/2oz or less copper cladding. the corresponding 50ohm transmissi on line has a strip width of about 460m [approx. 18 mils]. the contact areas on the motherboard for the packag e connections should be designed according to the footprint given above. the proper via structure under the ground pad is very important in order to achieve a good rf and lifetim e performance. all tests have been done by using a grid of plenty plated through vias with a diameter of less than 200m [8 mils] and a spacing of less than 400m [16 mils] from the cen tres of two adjacent vias. the via grid should cover the whole space under the ground pad a nd the vias closest to the rf ports should be located near the edge of the pad to allow a good rf ground connection. since the vias are important for heat transfer, a proper via filling should be guaranteed during the mounting procedure to get a low thermal resistance between package and heat sink. for power devices the use of heat slugs in the motherbo ard instead of a grid of vias is recommended. for the mounting process the smd type package can b e handled as a standard surface mount component. the use of either solder or conduc tive epoxy is possible. the solder thickness after reflow should be typical 50m [2 mi ls] and the lateral alignment between the package and the motherboard should be within 50m [ 2 mils]. caution should be taken to obtain a good and reliable contact over the whole p ad areas. voids or other improper connections, in particular, between the ground pads of motherboard and package will lead to a deterioration of the rf performance and the heat dissipation. the latter effect can reduce drastically reliability and lifetime of the product .
dc-12ghz attenuator cht3091aqag ref. dscht3091aqag0211 - 30 jul 2010 5/ 6 specifications subject to change without notice route dpartementale 128, b.p.46 - 91401 orsay ced ex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 recommended footprint for 16l-qfn3x3 the rf ports are not dc blocked. there are no dc ca pacitors in the package. smd mounting procedure the smd leadless package has been designed for high volume surface mount pcb assembly process. the dimensions and footprint requ ired for the pcb (motherboard) are given in the drawings above. for the mounting process standard techniques involv ing solder paste and a suitable reflow process can be used. for further details, see appli cation note an0005.
cht3091aqag dc- 12ghz attenuator ref. : dscht3091aqag0211 - 30 jul 2010 6/6 specific ations subject to change without notice route dpartementale 128, b.p.46 - 91401 orsay ced ex - france tel.: +33 (0) 1 69 33 03 08 - fax: +33 (0) 1 69 33 03 09 package outline: ordering information qfn 3x3 rohs compliant package: cht3091aqag/xy stick: xy = 20 tape & reel: xy = 21 information furnished is believed to be accurate an d reliable. however united monolithic semiconductors s.a.s. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by impli cation or otherwise under any patent or patent rights of united monolithic semiconductors s.a.s. . specifications mentioned in this publication are subject to change without notice. this publication supersedes and re places all information previously supplied. united monolithic semiconductors s.a.s. products are not authorised for use as critical components in life support devices or s ystems without express written approval from united monolithic semiconductors s.a.s.
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